Metal Pitch 18nm Semi-Damascene Spacer-is-Dielectric SADP Process Integration for Beyond A10 Technology Node

Chen Wu, Vincent Renaud, Stephane Lariviere,Stefan Decoster, Yannick Hermans,Quoc Toan Le, Hanne DeCoster, Bart Kenens, Diana Tsvetanova, Alfonso Sepulveda Marquez,Gayle Murdoch,Seongho Park,Zsolt Tokei

Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials（2023）

Cited 0|Views10

No score

AI Read Science

Must-Reading Tree

Example

Generate MRT to find the research sequence of this paper

Chat Paper

Summary is being generated by the instructions you defined