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Research Interests

Papers共 159 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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Metal Pitch 18nm Semi-Damascene Spacer-is-Dielectric SADP Process Integration for Beyond A10 Technology Node
Chen Wu, Vincent Renaud,Stephane Lariviere,Stefan Decoster, Yannick Hermans,Quoc Toan Le, Hanne DeCoster,Bart Kenens, Diana Tsvetanova, Alfonso Sepulveda Marquez,Gayle Murdoch,Seongho Park,
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials (2023)
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Wet Cleaning/Etching of NiAl Thin Film
Quoc Toan Le, Ersin Arslan, Kevin Fundu,Jean Philippe Soulie,Efraín Altamirano-Sánchez
Solid State Phenomena (2023): 341-345
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0
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A Cleaning Method for Post-Etch Ruthenium Residue Removal Using UV and Liquid Chemical
T. Nakano,Quoc Toan Le, Hikaru Kawarazaki, Takayoshi Tanaka,Efraín Altamirano-Sánchez
Solid State Phenomena (2023): 335-340
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0
0
Two-level Semi-damascene interconnect with fully self-aligned Vias at MP18
Giulio Marti,Ankit Pokhrel,Gayle Murdoch,Gilles Delie,Anshul Gupta, Philippe Marien,Alicja Leśniewska,Stefan Decoster,Souvik Kundu,Quoc Toan Le,Yusuke Oniki,Bart Kenens,
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)pp.1-3, (2023)
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Wet Cleaning of Ru Semi-Damascene 18 MP Structures
Hacı Osman Güvenç,Andreas Klipp,Quoc Toan Le
Solid State Phenomena (2023): 331-334
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First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP
Gayle Murdoch, M. O'Toole, G. Marti, A. Pokhrel,D. Tsvetanova,S. Decoster,S. Kundu,Y. Oniki, A. Thiam,Q. T. Le,O. Varela Pedreira,Alicja Lesniewska,
Symposium on VLSI Technology (VLSI Technology)pp.1-2, (2022)
Cited4Views0EIWOSBibtex
4
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