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Research Interests

Papers共 36 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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Extreme UV Self-Aligned Double Patterning process optimization for BEOL interconnections on 3nm nodes and beyond
D. Montero, N. Buccheri, Q. Lin, S. Roy,S. Paolillo,C. Wu, Y. Hermans,S. Decoster, B. Baudemprez, J. F. Finoulst,F. Lazzarino,S. Park,
ADVANCED ETCH TECHNOLOGY AND PROCESS INTEGRATION FOR NANOPATTERNING XIII (2024)
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Metal Pitch 18nm Semi-Damascene Spacer-is-Dielectric SADP Process Integration for Beyond A10 Technology Node
Chen Wu, Vincent Renaud, Stephane Lariviere,Stefan Decoster, Yannick Hermans,Quoc Toan Le, Hanne DeCoster, Bart Kenens, Diana Tsvetanova, Alfonso Sepulveda Marquez,Gayle Murdoch,Seongho Park,
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials (2023)
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Selective ALD Mo Deposition in 10nm Contacts
Marleen H. van der Veen, J. W. Maes,O. Varela Pedreiral,C. Zhu, D. Tiernol, S. Datta, N. Jourdan, S. Decosterl,C. Wu,M. Mousa, Y. Byun, H. Struyf,
2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAM (2023)
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Selective ALD Mo Deposition in 10nm Contacts
Marleen H. van der Veen, J. W. Maes,O. Varela Pedreira,C. Zhu, D. Tierno, S. Datta, N. Jourdan, S. Decoster,C. Wu,M. Mousa, Y. Byun, H. Struyf,
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)pp.1-3, (2023)
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Improving uniformity of 3-level High Aspect Ratio Supervias
D. Montero, P. Marien,Y. Hermans,V. Vega-Gonzalez,Y. Feurprier,N. Oikawa,N. Buccheri,C. Wu, G. T. Martinez,D. Batuk, H. Puliyalil, S. Decoster,
2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAMpp.1-3, (2023)
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Integration of Al2O3 Etch Stop Layer in 21nm Pitch Dual-Damascene BEOL interconnects
C. Wu, V. Vega-Gonzalez, H. De Coster,Q. T. Le,F. Schleicher, A. Leśniewska, G. Murdoch,S. Park,Zs. Tőkei
2022 IEEE International Interconnect Technology Conference (IITC)pp.79-81, (2022)
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