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Comprehensive optical losses investigation of VLSI Silicon optomechanical ring resonator sensors

2018 IEEE International Electron Devices Meeting (IEDM)(2018)

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Abstract
Cavity optomechanics devices are leading edge candidates for a new generation of sensors both in the quantum and classical realms. Several single devices have been demonstrated in numerous labs, however large-scale integration capability necessary for industrial deployment is still an issue. In this paper, we present very-large-scale integrated (VLSI) optomechanical sensors fabricated from standard 200 mm Silicon-On-Insulator (SOI) wafers. Optical properties over a statistically significant sample size have been systematically investigated and show an excellent modeling to experiment agreement, a coupling parameter dispersion of 7% and a manufacturing yield larger than 98%. Controlled versatile sensors, such as these, could easily be embedded in any chip where mass or force sensing is needed.
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Key words
cavity optomechanics devices,large-scale integration capability,very-large-scale integrated optomechanical sensors,optical properties,silicon-on-insulator wafers,optical loss investigation,VLSI silicon optomechanical ring resonator sensors,SOI wafer,coupling parameter dispersion,mass sensing,force sensing,size 200.0 mm,Si
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