Augmenting Manycore Programmable Accelerators With Photonic Interconnect Technology For The High-End Embedded Computing Domain

Networks-on-Chip(2014)

引用 4|浏览14
暂无评分
摘要
There is today consensus on the fact that optical interconnects can relieve bandwidth density concerns at integrated circuit boundaries. However, when it comes to the extension of this emerging interconnect technology to on-chip communication as well, such consensus seems to fall apart. The main reason consists of a fundamental lack of compelling cases proving the superior performance and/or energy properties yielded by devices of practical interest, when re-architected around a photonically-integrated communication fabric. This paper takes its steps from the consideration that manycore computing platforms are gaining momentum in the high-end embedded computing domain in the form of general-purpose programmable accelerators. Hence, the performance and energy implications when augmenting these devices with optical interconnect technology are derived by means of an accurate benchmarking framework against an aggressively optimized electrical counterpart.
更多
查看译文
关键词
electronic engineering computing,integrated optoelectronics,microprocessor chips,optical interconnections,bandwidth density concern,general-purpose programmable accelerator,high-end embedded computing domain,integrated circuit boundary,manycore computing platform,manycore programmable accelerator,on-chip communication,optical interconnect technology,photonic interconnect technology,photonically-integrated communication fabric
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要