Design Technology Co-Optimization of 3D SRAM Macro in Nanosheet Technology for High-Bandwidth Applications

Anurag Swarnkar, Dawit Abdi, Bhawana Kumari, Priya Venugopal, Nicolas Pantano,Geert Hellings,Jaydeep Kulkarni, Dwaipayan Biswas,Julien Ryckaert, Fernando Garcia Redondo

2025 IEEE International Memory Workshop (IMW)（2025）

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Key words

3D SRAM,Fine pitch Interconnect,Staggered configuration,Face-to-face bonding,Bandwidth improvement

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