Electroplated In–In Flip-Chip Interconnection for Superconducting Quantum Application

Jiexun Yu, Changming Song, Shuaipeng Wang, Yongbo Wu,Qian Wang, Haiyan Ma, Zheqi Xu,Tiefu Li,Jian Cai

IEEE Transactions on Electron Devices（2025）

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Key words

Bonding,chiplet,indium,superconducting quantum

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