Dimensional Effects on Grain Size and Surface Orientation of Nanocrystalline Cu in SiO2 Micro-Vias
2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)（2025）
关键词
Nanocrystalline Cu,Damascene process,Low temperature Cu-Cu bonding
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要