Benchmarking and Reproducibility in Computational and Experimental Characterization of Electronic Packages for Signal/Power Integrity: Four Benchmarks Serve As Standardized Cases

Heidi Barnes,Kemal Aygün, Michael J. Hill,Zhichao Zhang, Kaisheng Hu,Jonatan Aronsson, Pavel Paladhi, Jayaprakash Balachandran, Bobi Shi,Rohit Sharma, José E. Schutt-Ainé, Vladimir I. Okhmatovski

IEEE Antennas and Propagation Magazine（2025）

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关键词

Benchmark,Electronic Packaging,Measurement Data,Ongoing Efforts,Advanced Software,Heterogeneous Integration,Machine Learning Datasets,Machine Learning Models,Finite Element Method,Material Parameters,Transmission Line,Problem Areas,Simulation Accuracy,Simulation Tool,Method Of Moments,Loss Tangent,Vector Network Analyzer,Physical Layer,Insertion Loss,Finite-difference Time-domain,Dielectric Model,Test Vehicle,Boundary Element Method,Time Domain Reflectometry,Radio Frequency Applications,Test Board,Time-domain Waveform,Network Analysis,Design Software

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