Process Optimization to Improve Electrical Performance of Aluminum Filled Via-Last TSV for BSI Applications
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)（2024）
关键词
Electrical Performance,Backside Illuminated,Impedance,Cleaning Process,Key Step In This Process,High Temperature,Conductive,Grain Size,Surface Energy,Device Performance,Thermal Expansion,Deposition Process,Process Flow,Contact Resistance,Higher Deposition,Metal Layer,Barrier Layer,Cleaning Agents,Aluminum Metal,Aluminum Surface,Metal Lines,Copper Exposure,Aluminum Atoms,Aluminum Film
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