Niobium- Last Process for Multi-Foundry-Compatible Wafer Level Processing of Superconducting Interposers

Yong Chyn Ng, Simon Chun Kiat Goh, Javier Jun Wei Ong, Daniel Lau, Ya-Ching Tseng, Norhanani Jaafar, Jae Ok Yoo, Liyuan Liu, Everline Teo, Nicholas Boon Leong Chua,Hongyu Li

2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)（2024）

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Wafer Level,Critical Temperature,Superconductivity,Dilution Refrigerator,Heat Resistance,Variable Thickness,Quantum Computing,External Perturbations,Sharp Transition,Bias Current

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