Analog Computation in Ultra-High Density 3D FeNAND for TB-level Hyperscale AI Models
2024 IEEE International Electron Devices Meeting (IEDM)（2024）
Key words
Artificial Intelligence Models,Analog Computing,Computational Efficiency,Conductance States,2D Array,3D Array,Gate Stack,3D Structure,Energy Efficiency,Properties Of Cells,Power Consumption,Model Size,Voltage Drop,Current Range,Accuracy Of Samples,Charge Trapping,Ideal Line,Peripheral Circuits,Word Line
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