Next Generation TSMC-SoIC® Platform for Ultra-High Bandwidth HPC Application

Yen-Ming Chen, T. Ko, K. C. Ting, S. K. Goel, A. Patidar, K. H. Tam, K. Huang, W. P. Changchien, W. Y. Wang, S.H. Huang, C. Y. Huang, C. H. Wang, W. Lai, Y. H. Lung, S. C. Lin, S. F. Yeh, C. W. Shih, T.J. Wu, Y. C. Lin, Y. H. Chen,H. J. Lin, M. S. Yeh, T. Y. Chen, H. Y. Pan, T. S. Lin, C.C. Hu, C. Bair,S. B. Jan, L.C. Hung, L. W. Wang,D. H. Chen, C. H. Yao, T. C. Huang, J. H. Shieh, W. C. Chiou,S. S. Lin,Frank Lee,Geoffrey Yeap, L.C. Lu,K. C. Hsu

2024 IEEE International Electron Devices Meeting (IEDM)（2024）

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Key words

High-performance Computing,High Performance Computing Applications,Ultra-high Bandwidth,Device Performance,Thermal Characteristics,3D Technology,Reliable Characterization,Advanced Software,Test Vehicle,Processing Nodes,Moore’s Law,High Bandwidth,Electrostatic Discharge

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