Mechanism of Pit Formation on Surface of Superconducting Niobium Cavities During Buffered Chemical Polishing

Zheng Wang,Jinfang Chen, Yawei Huang,Yue Zong, Shuai Xing,Jiani Wu, Xiaowei Wu, Pengcheng Dong, Runzhi Xia, Xiaohu Wang, Xuhao He, Miyimin Zhao,Zhaoxi Chen,Xuerong Liu,Dong Wang

Materials (Basel, Switzerland)（2025）

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Key words

superconducting cavity,buffered chemical polishing (BCP),pit,bubble,niobium sample,mechanism

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