Growth Behavior of Intermetallic Layers in Sn-0.7Cu-xNi/Cu Interfaces: A Study on Aging Time Influence
Materials Today Communications（2025）
关键词
Lead-free solder alloy,Interfacial reaction,Intermetallics,Aging,Hardness
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要