Manufacturing Reliability Assessment of Fine Ag Alloy Wire During Wire Loop Formation Process
IEEE ACCESS（2025）
关键词
Wire,Metals,Bonding,Strain,Testing,Stress,Temperature measurement,Mechanical factors,Reliability,Thermomechanical processes,Ag alloy wire,wire bonding,micro-tensile test,temperature-dependence mechanical properties,Johnson-Cook constitutive model,transient dynamic simulation
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