3D Laser Structuring of Supermetalphobic Microstructures Inside Elastomer for Multilayer High-Density Interconnect Soft Electronics

Chengjun Zhang,Qing Yang,Haoyu Li, Zexiang Luo, Yu Lu, Jialiang Zhang, Cheng Li,Feng Chen

INTERNATIONAL JOURNAL OF EXTREME MANUFACTURING（2025）

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3D soft electronics,liquid metal,high-density interconnection,femtosecond laser direct writing,supermetalphobicity

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