Physical Layout Extraction Via Ion Milling Based IC Delayering for Reverse Engineering Applications
2024 IEEE Physical Assurance and Inspection of Electronics (PAINE)（2024）
关键词
Physical Layout extraction,Reverse Engineering,IC Delayering,Ion Milling,Image Segmentation,Swin Transformer,Generative Adversarial Networks (GAN)
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要