Towards TSV-Compatible Microfluidic Cooling for 3D ICs

Geyu Yan, Euichul Chung, Erik Masselink,Shane Oh,Muneeb Zia,Bharath Ramakrishnan,Vaidehi Oruganti,Husam Alissa,Christian Belady, Yunhyeok Im,Yogendra Joshi,Muhannad S. Bakir

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY（2025）

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Key words

Through-silicon vias,Three-dimensional displays,Cooling,Copper,Microfluidics,Resistance heating,Heat sinks,Fabrication,Silicon,Power dissipation,3-D integrated circuit (3D IC),data center efficiency,microfluidic cooling,micropin-fin,through-silicon via (TSV)

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