Elevated-Epi (elepi) Technique for 3D IC with Stacked FinFETs, Interlevel Metal, and 25 X 33 Mm2 Single-Crystalline Silicon on SiO2

Bo-Jheng Shih,Yu-Ming Pan,Hao-Tung Chung, Chieh-Ling Lee,I-Chun Hsieh,Nein-Chih Lin,Chih-Chao Yang,Po-Tsang Huang,Hung-Ming Chen,Chiao-Yen Wang,Huan-Yu Chiu,Huang-Chung Cheng,Chang-Hong Shen,Kuan-Neng Chen,Chenming Hu

IEEE TRANSACTIONS ON ELECTRON DEVICES（2024）

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关键词

Silicon,FinFETs,Metals,Epitaxial growth,Three-dimensional displays,Performance evaluation,Lattices,Integrated circuit interconnections,Etching,Standards,3-D integrated circuits (3D IC),elevated-epi,laser recrystallization

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