Surface Characteristics Optimization During Wafer-Level Backside Silicon Removal for Soi Wafers in 3d Integration

Bo-Jheng Shih, Zih-Yang Chen, Shie-Ping Chang, Ting-Yu Chen, Po-Jung Sung, Nien-Chih Lin,Chih-Chao Yang,Po-Tsang Huang,Huang-Chung Cheng, Ming-Yang Li,Iuliana P. Radu,Kuan-Neng Chen

Applied Surface Science（2025）

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