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1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics

Xin Li,Sajay Bhuvanendran Nair Gourikutty,Jiaqi Wu,Teck Guan Lim,Pengfei Guo, Jaye Charles Davies,Edward Sing Chee Koh,Boon Long Lau,Ming Chinq Jong,Ser Choong Chong, San Sandra, Chao Li,Guo-Qiang Lo,Surya Bhattacharya,Jason Tsung-Yang Liow

Journal of Lightwave Technology（2024）

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Key words
advanced packaging,Co-Packaged Optics,Fan-Out Wafer Level Packaging,silicon photonics
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