A Hermetic Conformal Coating Based High-Temperature Encapsulation Method for 250 ℃ SiC Power Module
IEEE TRANSACTIONS ON POWER ELECTRONICS（2025）
关键词
Silicon carbide,Coatings,Multichip modules,Reliability,Temperature distribution,Resistance,Insulation,Switches,Stress,Wires,Hermetic conformal coating (HCC),high-temperature applications,packaging and integration,silicon carbide (SiC) power module,wide bandgap (WBG) power device
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