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Self-aligned 8nm T2T As Cell Boundary in the Middle-of-line

P. Marien,Y. Hermans,S. Choudhury,S. Kundu,S. Decoster, F.U. Okudur, N. Reddy, B. Kenens,N. Jourdan, G. Delie,G. Marti,C. Wu, V. V. Gonzalez,G. Murdoch,S. Park,Z. Tőkei

2024 IEEE International Interconnect Technology Conference (IITC)（2024）

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Key words
MOL,scaling booster,tight cell boundary,4T standard cell,self-aligned tip-to-tip,metal etch
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