Front-side Integration of Middle-of-line Stacked Contacts for Monolithic CFET
V. Vega-Gonzalez, K. Stiers, C. Sheng,S. Demuynck,C Toledo de Carvalho Cavalcante, L. Petersen,T. Chiarella,J. Boemmels, T. Sarkar, N. Franchina Vergel,D. Radisic,R. Loo,E. Rosseel,C. Porret,G. Mannaert,S. Choudhury,V. Brissonneau,E. Dupuy,A. Peter,N. Jourdan,J-P. Soulié,T. Hakamata, A. Romo-Negreira,R. Clark,K. Vandersmissen,F. Sebaai,P. Puttarame Gowda, J.G. Lai, A. Mingardi, S. Kumar Sarkar,B. T. Chan, A. Sepulveda Marquez,R. Langer, I. Gyo Koo,E. Altamirano Sanchez,K. Devriendt, P. Rincon Delgadillo,F. Lazzarino,J. Mitard,J. Geypen,D. Batuk, Y-F. Chen, F. Verbeeck,F. Holsteyns,S. Subramanian,Zs. Tőkei,N. Horiguchi,S. Biesemans 2024 IEEE International Interconnect Technology Conference (IITC)（2024）
Key words
CFET,MOL,Middle-of-line,integration
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