Integration of InP Based Double Heterojunction Bipolar Transistor on Silicon Interposer and Associated RF Characterization

A. Oliveira, O. Valorge,A. Divay,H. Boutry,T. Mourier,F. Berger,C. Dubarry,J. Lugo-Alvarez,Y. Roelens,M. Zaknoune

2024 54TH EUROPEAN MICROWAVE CONFERENCE, EUMC 2024（2024）

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Key words

Indium Phosphide (InP),Double Heterojunction Bipolar Transistor ( DHBT),chiplet heterogeneous integration,flip chip assembly,mu bumps interconnections

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