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An Introduction to Wire-Bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®

Kaneeze Noorul Ain, Guo Qi Zhang,Augusto Rodrigues,Md Nazmul Hasan,Dominik Holzmann,Karen Geens,Urmimala Chatterjee,Ali Roshanghias

2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)（2024）

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关键词
GaN packaging,Sinterconnect®,power packaging,Cu printing,top-side interconnects
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