Stress Measurement and Simulation of the Key Silicon-Based Structures Based on Infrared Photoelasticity
OPTICS AND LASERS IN ENGINEERING（2025）
Key words
Through silicon vias (TSV),Micro-electromechanical systems (MEMS),Infrared photoelasticity,Finite element simulation,Polarization camera
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined