An Equivalent Circuit Model for Elliptic Cylindrical TSV Considering the Temperature Influence
2024 INTERNATIONAL SYMPOSIUM OF ELECTRONICS DESIGN AUTOMATION, ISEDA 2024（2024）
关键词
through silicon via (TSV),circuit model,finite element method,temperature effect
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要