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Mechanical Properties and Microstructure Evolution of Sn–Bi-based Solder Joints by Microalloying Regulation Mechanism

Xuefeng Wu,Zhuangzhuang Hou,Xiaochen Xie,Pengrong Lin,Yongjun Huo,Yong Wang,Xiuchen Zhao

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T（2024）

Cited 1|Views17
Key words
Creep resistance,Mechanical properties,Wettability,Microstructure
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