High- Temperature Characterization of a Novel Junction Barrier Schottky Diode with Multi-Step Trenched Structure

Yanqiu Li,Zhiqiang Wang, Yunchan Wu, Shenxu Yu,Guoqing Xin,Xiaojie Shi

2024 IEEE 7th International Electrical and Energy Conference (CIEEC)(2024)

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摘要
In this paper, a Schottky diode with a new structure is introduced, and four other commercial devices with different structures are selected and compared by high-temperature static and dynamic characterization. Devices with new structures have outstanding advantages in static performance and have good high temperature stability.
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Schottky diode,Characterization
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