Design and Fabrication of a MEMS Temperature and Pressure Integrated Sensor with Back-Inlet Package Structure

Mimi Huang,Xiangguang Han,Libo Zhao, Shu Fan,Yong Xia,Zhixia Qiao, Wei Li,Yi Gao,Ping Yang, Shuai Chen, Zeyu Cui,Cheng Zhang,Zhikang Li,Xiaowei Hou

IEEE SENSORS JOURNAL（2024）

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关键词

Sensors,Temperature sensors,Resistors,Lead,Stress,Sensitivity,Micromechanical devices,Back-inlet packaging,micro-electro-mechanical system (MEMS),temperature and pressure integrated sensor

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