Electrochemical deposition of super-conductive Cu/MXene laminated composite foils with low thermal expansion coefficient

A novel Cu/Ti3C2TX laminated composite foil was prepared using a combination of electroplating and electrophoretic deposition. The results indicate that the average thermal expansion coefficient of the Cu/ Ti3C2TX composite foil decreased by 11.26% compared to that of pure copper. Due to the high electron mobility of Ti3C2TX and the favorable Cu/ Ti3C2TX interface, the electrical conductivity of the Cu/ Ti3C2TX composite foil exceeded that of pure copper by 8.7%, reaching 6.2147 x 107 Sm-1, and its thermal conductivity increased from 381.5 W/mK to 423.5 W/mK. The study revealed that a thinner, looser Ti3C2TX layer with fewer layers is more favorable for copper penetration and filling, enabling a continuous network-like structure and resulting in significantly improved thermal and electrical properties of the composite copper foil. These findings position the Cu/Ti3C2TX foil as a promising candidate for electronic encapsulation and super-conductivity.