Boring holes in Au nanoplates by active surface etching

In contrast to the conventional etching that makes nanoparticles rounder and our previous sharpening etching mode that causes serrated edges, here, we developed a new boring etching mode that targets the faces of Au nanoplates to make holes. The critical factors are the pre-incubation step with the ligand 2-mercapto-5-benzimidazolecarboxylic acid (MBIA) and the subsequent removal of excess ligands in the solution. Thus, etching is focused onto the few sites with initial loss of ligands, which cannot be quickly replaced. The choice of ligand MBIA is also of importance, as it carries negative charge and repels each other. Its inability of forming a dense layer probably plays a critical role in the site-selectivity for faces, because ligands at the higher curvature edges and corners are expected to have less repulsion. The etching results from the comproportionation reaction between Au3+ and Au0 in the nanoplates, where Br− coordination to Au and the extra stabilization from cetyltrimethylammonium bromide (CTAB) are essential. We believe that the ability of boring holes is an important tool for future synthetic designs.