A Novel High-fidelity System-level Model of Power Converters

In the domain of power electronics reliability, digital twin stands as a significant component and models serve as key point in digital twin. However, the correlation between existing models and physical waveforms exhibits a substantial discrepancy resulting in low level of accuracy. Furthermore, the predominant focus of research remains confined to the device-level, necessitating a broader examination encompassing higher system-level perspectives. In this paper, a novel high-fidelity system-level electrothermal model is proposed that encompasses FEM simulation for accurately representing self-heating devices, Laplace transform for circuit solution, and the rectification of parasitic parameters. To verify the accuracy of proposed model, a 1kW Buck converter was built and simulation ability of proposed model was validated under various mission profiles. The outcomes serve as a key step for achieving the system-level thermal modeling of converters, developing realistic waveform analysis, and enhancing the model’s adaptability to various mission profiles.