Fabrication and Packaging of a Heterogeneously Integrated, Flexible Micro-display and Optical Modeling for Quantum Dot Integration
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)(2024)
Abstract
We present our work on the heterogeneous integration of GaN microLEDs with CMOS drivers in a passive matrix-driven configuration to create a monochrome display using FlexTrate
TM
, a flexible, die-first, fan-out wafer level packaging (FOWLP) platform. We also study the use of quantum dots (QDs) deposited directly in a scaffold structure fabricated with Su-8 on PDMS for the purpose of color conversion. Additionally, we present an analytical model that gives insight into optical crosstalk from adjacent pixels and determines that direct deposition of quantum dots upon GaN microLEDs provide superior crosstalk reduction.
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Key words
MicroLEDs,Displays,heterogeneous integration,flexible electronics,quantum dots,optical crosstalk modeling,FHE
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