Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024（2024）
关键词
3D integration,computational fluid dynamics (CFD),through-silicon via (TSV),multi-objective optimization
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要