Characterization of 224 Gbps/lambda Interconnects in Co-Packaged Optics for Hyperscale Data Centers and AI/ML Clusters
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024（2024）
关键词
Vertical interconnects,Co-Packaged Optics,Fan-Out Wafer Level Package,Through Mold Via,Double-side probing
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