A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024(2024)
关键词
Optical Transceivers,Hyperscale Data Centers,High-performance computing,Silicon photonics,Heterogeneous Integration,2.5D,3D packaging,Optical Engine,Fan-out wafer-level packaging,Electronic Photonic Package
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