Electromagnetic-Thermal-Stress Multiphysics Modeling of a TD-LTE Triple Band Patch Antenna

Zhengwen Liao, Yifan Chen, Ruihua Liang, Jian Zhu,Ting Wan

2024 IEEE International Conference on Computational Electromagnetics (ICCEM)(2024)

引用 0|浏览0
暂无评分
摘要
In this work, A multi-physics field simulation method based on the finite element method is developed for reliability analysis of multi-band antennas. The Multiphysics field simulation describes the multidisciplinary characteristics of the multiband antenna such as electrical, thermal and mechanical. To confirm that the method is accurate, we apply the proposed method to the electrical-thermal-stress simulation of a TD-LTE triple band patch antenna and compare the results with the commercial software COMSOL.
更多
查看译文
关键词
electromagnetic,thermal,mechanical,finite element method (FEM)
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要