Effect of Thermal & Mechanical Stresses on Novel Microstrip Lines Printed on Flexible Substrates

Abdullah S. Obeidat,Emuobosan Enakerakpo,Ashraf Umar,Waleed Al-Shaibani,Mohamed Abdelatty, Sara Lieberman, Olya Noruz Shamsian,Riadh Al-Haidari,Mohammed Alhendi,Mark D. Poliks

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY（2024）

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Key words

Microstrip,Substrates,Radio frequency,Ink,Bending,Aging,Printing,Aerosol jet printing,flexible substrate,mechanical bending test,microstrip lines,photonic curing,thermal aging

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