Thermal stress and contact analysis utilizing tested temperature data in a kW-class external-manifold solid oxide fuel cell stack

Thermal stress and contact are two pivotal factors influencing the operational lifespan and performance of solid oxide fuel cell (SOFC) stacks. In practical kW-MW SOFC systems, stack boxes are typically constructed using kW-class stack blocks comprising dozens of cells. Temperature distribution affects the thermal stress distribution, thus affecting the contact of the stack. In this work, the thermal stress distribution and contact of a 2.5 kW external-manifold stack composed of 60 repeat units are investigated by using finite element analysis (FEA). To get a more accurate and realistic results, temperature data of a stack measured in an ongoing SOFC system is incorporated into the computational model. The influences of the clamp loads from manifolds, the structure of current collectors, the number of spacer plates, and the thickness of interconnects on the thermal stress distribution and contact of the stack are investigated. In the basic stack, the tensile stress induced by the temperature gradient appears to be the primary cause of the high thermal stress in the air inlet region of top cells. Due to the high-temperature strength of the seal material and endplates, the contact is inferior in cells near endplates. Increasing the clamp loads of manifolds within specified limits leads to a reduction in both the magnitude and area of high thermal stress, concurrently enhancing the stack contact. Strengthening the current collector structure induces more high-stress regions and simultaneously increases the stack contact. The introduction of overmuch spacer plates results in more high stress regions and a deterioration in stack contact. Moreover, increasing the thickness of interconnects introduces more high stress regions, negatively impacting stack contact.