Study on the Mechanism of Influence of Water Molecule Cooling and Vacuum Cooling on the Machining of Single Crystal Copper Nanos

Aiming to clarify the influence mechanism of water molecule cooling on the machining of single-crystal Cu nanocutting, this study conducts an in-depth investigation through molecular dynamics simulations, incorporating both qualitative and quantitative analyses. The focal points of the research include the distribution of Von Mises stress, shear strain, cutting temperature, and dislocation formation. In terms of Von Mises stress, water molecule cooling significantly reduces the average stress at a cutting speed of 10Å, and exhibits a turning point in stress reduction at a speed of 300m/s. The average stress under water molecule cooling is consistently lower than that under vacuum cooling, and the difference diminishes at a cutting speed of 20Å. Shear strain analysis reveals that at a cutting speed of 10Å, the chip height under water molecule cooling is notably lower than that under vacuum cooling, while at 15Å, it shows a trend of first decreasing and then increasing. The average chip height under vacuum cooling is 1.1 times that of water molecule cooling. At a cutting depth of 15Å, speeds of 200m/s and 300m/s both demonstrate superior cooling performance, with cutting temperatures significantly lower than vacuum cooling, with temperature differences of approximately 85K and 180K, respectively. Dislocation analysis indicates that under water molecule cooling, the number of dislocations at greater cutting depths is significantly higher than under vacuum cooling, predominantly consisting of 1/6<112> (Shockley) dislocations. Overall, water molecule cooling shows significant advantages in several aspects, significantly reducing stress, chip height, and cutting temperature, while increasing the number of dislocations. These results provide quantified empirical data for ultra-precision nanocutting machining, offering important references for engineering practice and positively contributing to the optimization of nanocutting process parameters.