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Advanced Fan-Out Embedded Chip Process Integration for 3D Application

Chih-Cheng Hsiao,Chao-Kai Hsu, Ching-Iang Li, Yung-Sheng Chang,Ming-Ji Dai, Feng-Hsiang Lo,Chin-Hung Wang,Wei-Chung Lo

2024 International Conference on Electronics Packaging (ICEP)（2024）

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Abstract
Technologies of fan-out embedded chip process integration are studies in this paper. We propose a pre-fabricated substrate with a programmable chip for customized proof of concept and small-volume production, the packaging module passed 1000 hours of TCT, uHAST, and MSL3 reliability testing without any failure from SEM inspection, and the function test of the capsule endoscope is also demonstrated in this paper.
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Key words
Fan-out wafer level packaging,Embedded chip,Through mold via
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