Unravelling the synergistic enhancement effect of Ag3Sn phase and graphene nanosheets addition on the thermal cycling reliability of Sn–xAg–0.7Cu solder joint
Journal of Materials Science: Materials in Electronics(2024)
Abstract
In the work, thermal cycling reliability of graphene nanosheets-doped Sn–xAg–Cu/Cu solder joint (x = 1, 2, and 3 wt.
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