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Unravelling the synergistic enhancement effect of Ag3Sn phase and graphene nanosheets addition on the thermal cycling reliability of Sn–xAg–0.7Cu solder joint

Jie Wu,Yiping Wu, Weiqing Huang, Ling Hu,Ping Wang,Binbin Xu,Guoqiang Huang, Guangyao Chen, Tianji Li,Yong Xu,Lei Wang,Zhikuang Cai

Journal of Materials Science: Materials in Electronics（2024）

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Abstract
In the work, thermal cycling reliability of graphene nanosheets-doped Sn–xAg–Cu/Cu solder joint (x = 1, 2, and 3 wt.
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