Exploring trade-offs in multi-site wafer testing.
Latin American Test Symposium(2024)
Abstract
Wafer testing is a crucial process used to test the die before packaging. The process has undergone significant changes in the past year to reduce costs and ensure enough test coverage while preserving machinery and die integrity. The process is associated with significant costs and consumes considerable time.In this paper, we aim to provide an overview of the current state of wafer testing and highlight the most critical aspects of this type of testing. We will discuss the direction of the industry in this sector by highlighting the potential critical issues introduced by the current technological limit when implementing future technologies like denser pad disposition and multi-site testing.
MoreTranslated text
Key words
Wafer Testing,Die,Cost Modelling,Testing
AI Read Science
Must-Reading Tree
Example
![](https://originalfileserver.aminer.cn/sys/aminer/pubs/mrt_preview.jpeg)
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined