Parametric investigation of the effects of variables controlling thermal characteristics during continuous and high-speed cold stamping processes with active cooling structures

Yuan Yao, Zuofang Yao, Wanghua Wei,Feng Bin,Junqin Huang,Xiaolin Wei, Qi Chen,Zirui Zhang

Applied Thermal Engineering(2024)

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Abstract
Knowledge of the thermal phenomena that occur during stamping is important for improving the design and performance of stamping die thermal structures. A new mathematical full-scale model for energy and carbon flows is established based on operational data from a cold stamping production line in China. Moreover, numerical simulations of the thermal-fluid–solid coupling field for a cooling medium in an asymmetrically heated rectangular channel with high heat flux and strong wall superheating are carried out with a suitable CFD solver. The results are discussed in detail and compared with theoretical calculations, and the deviation of the surface heat transfer coefficient is ± 11.9 %. Emphasis is placed on parametric effects of variables controlling thermal characteristics on cold stamping with an active cooling structure. The effects of heat flux, and ambient temperature on temperature rise, pressure drops, and heat transfer coefficients are limited less than 7 °C, 167 Pa and 45.11 % under specific operating conditions, respectively. While the heat transfer coefficient and pressure drops are increased hundreds of times with inlet velocity. The fluid cooling performance, threshold value, and approaches for heat transfer enhancement are obtained. Finally, the CO2 emissions rates is assessed as approximately 1.8 g per piece associated with stamping operations, as well as major contributors, CO2 reduction potential, and economic impacts. Negative energy consumption can be achieved with active cooling. These results can help to improve production quality in the future application and provide theoretical support for determining the causes of metal sheet tensile cracking accidents.
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Key words
Continuous and high-speed cold stamping,Active cooling structure,Thermal balance analysis,Heat transfer enhancement,Thermal-fluid–solid coupling
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