Coverage Path Planning for Thermal Interface Materials
CoRR(2024)
Abstract
Thermal management of power electronics and Electronic Control Units is
crucial in times of increasing power densities and limited assembly space.
Electric and autonomous vehicles are a prominent application field. Thermal
Interface Materials are used to transfer heat from a semiconductor to a
heatsink. They are applied along a dispense path onto the semiconductor and
spread over its entire surface once the heatsink is joined. To plan this
application path, design engineers typically perform an iterative
trial-and-error procedure of elaborate simulations and manual experiments. We
propose a fully automated optimization approach, which clearly outperforms the
current manual path planning and respects all relevant manufacturing
constraints. An optimum dispense path increases the reliability of the thermal
interface and makes the manufacturing more sustainable by reducing material
waste. We show results on multiple real products from automotive series
production, including an experimental validation on actual series manufacturing
equipment.
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