Effects of Polyvinyl Alcohol on Silicon Chemical Mechanical Polishing
2024 Conference of Science and Technology for Integrated Circuits (CSTIC)（2024）
Abstract
The effect of polyvinyl alcohol (PVA) in alkaline slurry on the silicon wafer surface during chemical mechanical polishing (CMP) was investigated. This investigation found that PVA is adsorbed onto the colloidal silica abrasive and silicon wafer surface, and that the adsorption amount increases in accordance with PVA concentration. Characterization and analysis were given by measuring the pH, viscosity, removal rate, the adsorption amount of PVA on the surface of colloidal silica particles, contact angle and local point defects of silicon wafer surface.
MoreTranslated text
Key words
Polyvinyl Alcohol,Chemical Mechanical Polishing,Effect Of Polyvinyl Alcohol,Contact Angle,Particle Surface,Silicon Wafer,Removal Rate,Colloidal Particles,Silicon Surface,Colloidal Silica,Colloidal Surface,Silicon Wafer Surface,Hydroxyl,Increase In Concentration,Aqueous Solution,Silica Surface,Abrasive Particles,Groups Of Polyvinyl Alcohol
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined