Study on the Slurry for Chemical Mechanical Polishing of GaN Wafer

The effects of oxidants in acidic and alkaline slurries on the chemical mechanical polishing (CMP) process of gallium nitride were studied. In order to better understand the enhancement effect of oxidants on GaN CMP performance, a reference experiment was established in this study. The experimental results show that SiO 2 -based slurry has good performance under acidic conditions, especially in terms of material removal rate (MRR). In addition, K 2 S 2 O 8 has a higher MRR and lower surface roughness (Sq) than H 2 O 2 under acidic conditions. The use of SiO 2 -based slurry containing K 2 S 2 O 8 can effectively produce a smooth GaN surface in addition to the classical CMP process.